Saed News: Despite U.S. sanctions, Huawei is expected to produce high-end chips with transistor density equivalent to 1.4-nanometer processors by 2031.
According to SAEDNEWS, citing Reuters, this prediction was presented by Huawei in a statement and represents a significant claim regarding what the company calls the “Tau Scaling Law,” a new principle for improving chips as the semiconductor industry can no longer rely solely on shrinking transistors.
He Tingbo, head of Huawei’s semiconductor business and director of the company’s research committee, introduced the new concept called “A New Semiconductor Path in Practice” during a speech at the 2026 IEEE conference in Shanghai. Although Huawei did not provide independent performance data, the target is considered important because 1.4-nanometer technology is expected to become the global frontier for advanced chip manufacturing by the end of the decade.
It is widely believed that China cannot independently achieve this level of production because the U.S. government has restricted its access to advanced lithography tools and other leading semiconductor technologies.
According to Huawei, the Tau Scaling Law focuses on reducing the time required for signals and data to travel between chips and computing systems. If successful, the technology could improve chip performance and density despite China’s limited access to the world’s most advanced semiconductor technologies.
Huawei’s Kirin chips, expected to launch in autumn 2026, will reportedly use a new architecture called “Logic Folding” for the first time. The company claims this structure shortens internal chip wiring and significantly boosts performance.
